Thermal Analysis of Optimized Porous Fin on Various Profiles: A Review

  Aditya Pratap Singh Jadaun,  Abhishek Arya,  B.M Rathore

A computer's CPU may perform millions of calculations every second .As the Processor continues to work at a rapid pace, it begins to generate heat. If this heat is not kept in check, the processor could overheat and eventually destroy itself. Fortunately, CPUs include a heat sink, which dissipates the heat from the processor, preventing it from overheating with the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management becomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers

Keywords- Pin fin heat sink, Electronics cooling simulation, Fin Profiles, Thermal Resistance

Unique Identification Number - IJEDR1502073
Page Number(s) - 393-399
Pubished in - Volume 3 | Issue 2 | May 2015
DOI (Digital Object Identifier) -   
Publisher - IJEDR (ISSN - 2321-9939)

  Aditya Pratap Singh Jadaun,  Abhishek Arya,  B.M Rathore,   "Thermal Analysis of Optimized Porous Fin on Various Profiles: A Review", International Journal of Engineering Development and Research (IJEDR), ISSN:2321-9939, Volume.3, Issue 2, pp.393-399, May 2015, Available at :http://www.ijedr.org/papers/IJEDR1502073.pdf